9th International Conference on Materials for Advanced Technologies

ICMAT 2017 | 18 - 23 June 2017 | Suntec Singapore

Symposium I

Extreme Mechanics –
Mechanical Behaviors of Nanoscale and Emerging Materials

Category: Functional Materials


Singapore University of Technology & Design, Singapore


Shailendra P JOSHI
National University of Singapore, Singapore

Institute of High Performance Computing, A*STAR, Singapore

Julia R. GREER
California Institute of Technology, USA

IMDEA Nanoscience Institute, Spain


Asst. Prof. Arief BUDIMAN
Singapore University of Technology & Design
Email: asbudiman@sutd.edu.sg




Symposium Scope

Mechanics of materials at the nanoscales and other emerging systems can be very different and thus may have important implications if the materials are to be used in real world engineering systems – in terms of performance, manufacturability and also reliability. Nanoscale materials have been known to have important size effects, but today many other emerging materials – due to their novel manufacturing routes, or enabled by them – have combined nanoscale effects with 3D microarchitecturing to reach and approach extreme limits of materials properties. For example, 3D microlattices have been reported to show ultra high strengths but also ultra light weight. Recently, biomimetic 3D-multi hierarchy materials have also received much attention as the 3D microarchitecture enabled by additive manufacturing can significantly enhance the fracture toughness of the materials while maintaining very light weight.

The focus of this symposium will be on all aspects of the development and analysis of emerging/extreme materials (nanoscale, 3D-printed, biomimetic/composites, strain-engineered, etc.) with enhanced mechanical properties reaching or approaching the extreme limits of materials properties. Fundamental studies on mechanical properties of nanoscale/extreme materials including ex-situ and in-situ SEM/TEM, synchrotron X-ray experiments as well as modeling and simulations on relevant length scales will be addressed. Extreme mechanics considerations will include mechanics under extreme conditions, materials with extreme mechanical properties, extreme length scales, extreme deformation and materials with extreme complexities. Nanomaterials of interest will consist of metals, ceramics, amorphous materials and their derivative containing carbon based materials.


Mechanics under extreme conditions

  • Shock loading
  • Deformation at high temperature
  • High radiation environments
  • High pressure environments


Materials with extreme mechanical properties

  • High fracture toughness
  • Ultra-hard materials
  • Materials for lightweighting


Mechanics at extreme length scales 

  • Nanomechanics
  • In-situ TEM/SEM of deformation
  • Mechanics of geological materials


Materials with extreme deformation

  • Soft materials
  • Flexible systems (stretchable, wearable, implantable, eg. For healthcare or biomedical applications)
  • Instability and large deformation in nature and important engineering systems


Mechanics of materials with extreme complexities

  • Morphing structures
  • 3d/4d printed structures
  • Hierarchical composites and nanocomposites
  • Biomimetic/multi-hierarchy systems
  • Mechanics (deformation and fracture) of next generation energy systems (battery, solar PV, etc.)
  • Mechanics of interfaces


Proceedings Publication

Papers reviewed and presented at this symposium will be published in Procedia Engineering by Elsevier.

Joerg BAGHAHN, Anhalt University of Applied Sciences, Germany
Jens BAUER, University of California, Irvine USA
In-Suk CHOI, Korea Institute of Science & Technology, South Korea
Reinhold DAUSKARDT, Stanford University, USA
Avinash DONGARE, University of Connecticut, USA
Chee Lip GAN, Nanyang Technological University, Singapore
Qiang GUO, Shanghai Jiao Tong University, China
Yuichi IKUHARA, The University of Tokyo, Japan
Young-Chang JOO, Seoul National University, South Korea
Volokh KONSTANTIN, Technion – Israel Institute of Technology, Israel
Alfonso NGAN, The University of Hong Kong, Hong Kong
Nam Gyu PARK, Sungkyunkwan University, South Korea
Stephan RUDYKH, Technion – Israel Institute of Technology, Israel
Yong-wei ZHANG, Institute of High Performance Computing, A*STAR, Singapore
Guang-Ping ZHANG, Institute of Metal Research, CAS, China