9th International Conference on Materials for Advanced Technologies

ICMAT 2017 | 18 - 23 June 2017 | Suntec Singapore

Symposium M

Additive Manufacturing for Fabrication of Advanced Materials/Devices

Category: Functional Materials

Chair

Jun DING
National University of Singapore, Singapore

Jerry FUH
National University of Singapore, Singapore

Co-Chairs

Chee Kai CHUA
Nanyang Technological University, Singapore

Nicholas X. FANG
Massachusetts Institute of Technology, USA

Jun WEI
Singapore Institute of Manufacturing Technology, A*STAR, Singapore

Correspondence

Prof. Jun DING
National University of Singapore
Singapore
Email: msedingj@nus.edu.sg

 

Symposium Scope

Initially created as a method for rapid prototyping – 3D printing, which is also referred to as Additive Manufacturing are emerging and has grown into a true manufacturing process. Compared to conventional manufacturing techniques, 3D printing provides a new pathway for device/component fabrication. Some novel structures, which could not be obtained by conventional techniques, might be possible with 3D printing. Apart of process design, materials research plays a critical role for fabrication of novel structures with multi-functionality for various applications. The scope of this symposium covers process design, materials research and investigation of relevant techniques:

  • Materials developed for additive manufacture
  • Devices and structures fabricated by additive manufacture
  • Development of additive manufacture techniques
  • Other advanced materials manufacture (such as laser welding and catting)

 

Proceedings Publication

Papers reviewed and presented at this symposium will be published in Procedia Engineering by Elsevier.

Shih-Chi CHEN, The Chinese University of Hong Kong, Hong Kong
Yong CHEN, University of Southern California, USA
Chee Kai CHUA, Nanyang Technological University, Singapore
Suman DAS, Georgia Tech, USA
Nicholas FANG, Massachusetts Institute of Technology, USA
Kevin, Qi GE, Singapore University of Technology and Design, Singapore
Liqun LI, Harbin Institute of Technology, China
Xiaochun LI, University of California Los Angeles, USA
Pan WANG, Singapore Institute of Manufacturing Technology, A*STAR, Singapore
An-Chou YEH, National Tsing Hua University, Taiwan
Jun YIN, Zhejiang University, China