Symposium Scope
The scope of this symposium is to cover the progress of ceramics, metal oxides and composite nano-structured materials for absorbing/shielding and related device applications. The symposium will cover wide range of materials processing methods, device design aspects, modeling and simulations, which will also encompasses nano materials coatings, nanostructure composites and bulk composites.
The control of electromagnetic interference (EMI) becoming significant in many EMI absorption and shielding applications in engineering and medicine. Design and development of suitable EMI absorption/shielding materials have attracted considerable attention in high frequency and high power electronics.
- Nano ceramic, metal oxide based materials for shielding applications
- Simulation and modeling of EMI absorbing/shielding materials
- Multi-functional nanostructured coatings and composites and devices
- Novel device concepts to achieve high frequency shielding and high power applications.
- Characterization and processing for shielding/absorbing applications
- Ferrites, conductive coatings, laminates, ceramics and polymer nano composites, etc. as EMI/RFI absorbing/shielding materials
- Thermal/magnetic properties of nano-materials
- High purity nanoparticles and composites synthesis and sintering methods
- Design, development and characterization of wide band EMI shielding
- Hierarchical composites and nano-structure interfaces characterization
Proceedings Publication
Papers reviewed and presented at this symposium will be published in Procedia Engineering by Elsevier.

M. Nadi BRAIDY, Université de Sherbrooke, Canada
Santanu CHATTOPADHYAY, IIT Kharagpur, India
Narayan Chandra DAS, Indian Institute of Technology, Kharagpur, India
Nicole R. DEMARQUETTE, École de Technologie Supérieure / Université du Quebec, Canada
Charu DWIVEDI, Doon University, India
Santhiagu EZHILVALAVAN, Republic Polytechnic, Singapore
John Zhanhu GUO, University of Tennessee, USA
Sung-Soo KIM, Chungbuk National University, South Korea
Marina Y. KOLEDINTSEVA, Oracle, Santa Clara, USA
Hong LIU, Shandong University, China
Dongling MA, Institut National de la Recherche Scientifique, Canada
James RAJU, University of Hyderabad, India
Raju V. RAMANUJAN, Nanyang Technological University, Singapore
Federico ROSEI, Institut National de la Recherche Scientifique, Canada
Himani SHARMA, Doon University, Dehradun, India
Mohamed SIAJ, Université du Québec à Montréal, Canada
Armand SOLDERA, Université de Sherbrooke, Canada
Shuhui SUN, Énergie Matériaux Télécommunications Research Centre, Canada
Sergei A. TRETYAKOV, Aalto University, Finland
Takanori TSUTAOKA, University of Hiroshima, Japan
Peiheng ZHOU, University of Electronic Science and Technology of China, Chengdu, China